capability

PCB capability
Item Project Capability Note
1 Layer Count 1L ~ 40L
HDI,Anylayer,depth controlled slot,Probe Card		 　
2 Laminate Materials FR4,PTFE,Polymide,Rogers,MCPCB,FR4+Rogers, Isola+FR4 　
3 Board Thickness Double-sided 0.2mm-8.0mm 　
Multilayer 0.3mm-8.0mm 　
4 Size finished dimensions(Maxma) 700mm width<500mm
finished dimensions(Minima) 10mm 　
5 Inner Layers Minimum space from drilling to inner pattern 3.5mil 　
Minima core thickness 0.08mm 　
Pad Ring(Minima) 4mil Tenting
Minimum trace width / space 2.5/2.5mil Copper Weight 0.5oz or less
6 Drilling Minimum size 0.1mm 　
hole tolerance (PTH & NPTH) NPTH+/- 2mil
PTH+/- 3mil		 　
Drill Deviation (True position size) +/- 2mil 　
Laser Drill 0.3mm or less 　
Aspect ratio 20 　
7 SMD PAD PAD Deviation ±25um 　
Pad Size (minima) 100um 　
Pad Size tolerance ±30um 　
Pad Pitch 200um 　
Pad Spacing 100um 　
8 Outer Layers Minimum trace width / space 2.5/2.5mil Copper Weight 0.5oz or less
9 Surface Finish HASL / Lead Free HASL(thickness) 0.7mil 　
immersion gold(thickness) 1u”-8u” 　
Hard gold plating (thickness) 3u” ~ 50u” 　
10 Solder Mask Thickness 0.4 mil ~ 2mil 　
Deviation 2mil 　
color green,light green,matte green,white,extreme white,black,matte black,purple,dark brown,yellow,red,blue,transparent 　
11 Silkscreen color white,black,yellow,red,blue,green 　
Minimum size 28mil 　
Minimum trace width 3mil inkjet printing
14 Copper Weight Inner copper weight 1/3 oz ~ 6 oz 　
Outer copper weight 0.7oz ~ 12oz 　
15 Bow and twist 3/1000~7/1000 　
16 BGA PAD Ball Pitch 12mil no trace between BGA pad
Ball spacing 4mil